Technology

This process makes fine wire by using die. Wire is processed gradually reduce diameter. Wire become stronger while through this process in strain hardening.

This process adjusts the metal structure by heating and cooling the wire, optimizing mechanical properties such as strength and ductility.

To prepare the wire surface for drawing, scale is removed and the surface is treated to improve drawability.

This process twists wires drawn to a specified diameter together, improving the flexibility, fatigue resistance, and overall performance of steel cords.

Bead wire is coated with a bronze plating of copper and tin, while steel cord is coated with a brass plating of copper and zinc.

Round wire is drawn through a shaped die to form a non-circular cross-sectional shape.

Round wire is formed into a non-circular cross-sectional shape using rollers.

This technology applies fine grinding and bending processes to the tips of precious metal or alloy wires with diameters of several tens to several hundreds of micrometers.

This is a processing technology that produces metal particles by controlling nano-scale particle size, shape (such as spherical, angular, or flake), sintering temperature, and other quality properties.

Wire processed to a specified size is precisely straightened to achieve a high level of straightness.

Wires and tubes are assembled using processes such as laser welding and crimping.

This includes wire drawing, heat treatment, and other processing of precious metals and non-ferrous metals.

Single or multiple wires are wound into a coil shape to produce special coils.

A process that reduces wire diameter to thinner than a human hair.

Multiple ultra-fine wires are twisted together to form an ultra-fine rope-like structure.

Wire processed by ultra-fine drawing is further formed into ultra-thin shaped wire.

A process that applies functional coatings to wire surfaces, providing special properties such as low friction that are not inherent to metals.

A process that forms tapered or stepped diameters on a straight wire.

An electron microscope that enables observation of fine surface structures at extremely high resolution.

An Auger electron spectrometer (AES) is an analytical instrument for qualitative and quantitative analysis of elements within several nanometers of a material surface. Depth profiling is possible using an etching function. Because an electron beam is used as the excitation source, AES is well suited for microscopic area analysis.

XPS (ESCA) is a surface analytical instrument for examining the elemental composition and chemical states of a material surface within a depth of a few nanometers. The analysis area is defined by the focused X‑ray beam.

XRD is a non-destructive analytical instrument for analyzing the crystal structure and orientation of materials using X‑ray diffraction. The analysis depth ranges from a few to several tens of micro meters.

ICP is an emission spectroscopic analytical instrument in which samples are ionized using high‑temperature argon plasma.

GC is an analytical instrument that separates and quantifies volatile components carried by a carrier gas through a column.

We machine components such as spindles and main rollers used in wafer slicing equipment.

This equipment is used for machining main rollers and resin rollers for wafer slicing equipment and is capable of processing a wide variety of groove shapes and pitches to meet customer requirements.

We manufacture rollers for wire rolling. The rollers must have sufficient strength to withstand the wire, and their outer surfaces are mirror‑finished to prevent damage to the wire.

We manufacture wire drawing dies with fine holes processed in cemented carbide and diamond. In addition, mirror finishing of these fine holes is also available.

We manufacture wire drawing dies with fine holes processed in cemented carbide and diamond. In addition, mirror finishing of these fine holes is also available.

This equipment is used for measuring and evaluating the products. Depending on whether the measurement target is three‑dimensional shape evaluation (geometric tolerances) or cross‑sectional profile evaluation, different instruments are selected for measurement.